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This paper aims to provide SIF calculation method for engineering application.

In this paper, the stress intensity factors (SIFs) calculation method is applied to the anisotropic Ni-based single crystal film cooling holes (FCHs) structure.

Based on contour integral, the anisotropic SIFs analysis finite element method (FEM) in Ni-based single crystal is proposed. The applicability and mesh independence of the method is assessed by comparing the calculated SIFs using mode of plate with an edge crack. Anisotropic SIFs can be calculated with excellent accuracy using the finite element contour integral approach. Then, the effect of crystal orientation and FCHs interference on the anisotropic SIFs is clarified. The SIFs of FCH edge crack in the [011] orientated Ni-based single crystal increases faster than the other two orientations. And the SIF of horizontal interference FCHs edge crack is also larger than that of the inclined interference one.

The SIFs of the FCH edge crack in the turbine air-cooled blade are innovatively computed using the sub-model method. Both the Mode I and II SIFs of FCHs edge crack in blade increase with crack growing.

The purpose of this paper is to propose a modal method to calculate the band gaps of one-dimensional (1D) phononic crystals.

The phononic crystals have modes with exponential form envelope in the band gaps, however, outside the band gaps the modes are of amplitude modulation periodic form. Thus the start and end frequencies of band gaps can be determined from the existence conditions of periodic modes. So, the band gaps calculation of 1D phononic crystal is transformed into the existence discussion of periodic solution of mode shapes equation. The results are verified by finite element harmonic response analysis.

At the start and end frequencies of the band gap, the mode equation have solution with period of lattice constant.

Compared with the traditional theoretical methods, the proposed modal method has a clearer principle and easier calculation.

At the end of this chapter, learners should be able to:

• Explain what redundancy is.

• Understand how to manage redundancy.

• Calculate redundancy pay.

• Understand the support available for surviving employees.

Explain what redundancy is.

Understand how to manage redundancy.

Calculate redundancy pay.

Understand the support available for surviving employees.

This paper sets out to highlight selected projects in nanosensor research, demystify the technology and show potential applications in engineering fields.

Nano devices for sensing humidity and oxygen concentration are presented with applications in industrial monitoring. Then two approaches to the development of high‐density optical memory are given. Next, a miniature flow cytometry system is described for the identification of marine micro‐organisms and bacteria. Finally, photonic crystal structures with the ability to control and manipulate light are addressed.

“Nano” is currently a popular term, with a mass of publications in this area. Many universities have set up specialised centres for nanotechnology research. Crystalline materials with shape‐selective nanopores can be designed to detect particular chemicals. Successful nanosensors are sensitive, simple, fast and low‐cost.

This paper helps the general engineer to appreciate some aspects of nanotechnology. References to recent publications allow engineers to follow up their interests.

In general, lighting application, white light emitting diode (LED) usually exposed to an extreme operating temperature of above 90°C. It is well-known that luminous efficacy and spectral characteristic of white LED are dependent on the temperature, causing thermal effects on luminous efficacy and color shift of white LED become a critical application checkpoint to be addressed by white LED manufactures. Thus, the purpose of this paper is to minimize the thermal stability issue affecting white LED luminescence during operation by introducing phosphor sedimentation process.

The LED samples were assembled and sent for centrifugation with 0, 5 and 10 revolutions per second (rps), respectively, during phosphor sedimentation process. Luminescence properties of these LED samples were then characterized at a varying temperature to investigate the effect of phosphor sedimentation on the luminescence stability of LED samples. The LED samples were also cross-sectioned and analyzed to understand the phosphor sedimentation mechanism. Computational fluid dynamics (CFD) was applied to study the temperature distribution of the non-phosphor sediment (NPS) and phosphor sediment (PS) LED during operation to validate the hypotheses based on experimental data.

Experimental results show that the luminous intensity of PS LED samples degrades less significant at high temperature. The experimental results also show that the color coordinate for PS LED samples is more stable and is less blue-shifted than NPS LED samples as the temperature increased. These are because the heat generated by phosphor particles during operation can be dissipated effectively throughout a high thermal conductivity substrate after phosphor sedimentation. Thus, the phosphor temperature of PS LED is lower than NPS LED during operation as validated with the thermal simulation.

The study of this paper is applicable as a reference for industries who intend to resolve the thermal stability of white LED during operation. The luminescence properties changes as a function of the temperature study in this paper can be used to predict the application performances of white LED accurately. Apart from that, the analysis method of temperature distribution using CFD simulations can be extended by other CFD users in the future.

Implementation of phosphor sedimentation to reduce thermal instability issue of white LED has yet to be reported on previous studies. Most literature just studied the thermal instability issue of either assembled LED or raw material, without suggesting any solution to tackle the issue.

This paper aims to study the influence of the Cu-Al₂O₃ film-coated Cu substrate as a thermal interface material (TIM) on the thermal and optical behaviour of the light-emitting diode (LED) package and the annealing effect on the thermal and optical properties of the films.

A layer-stacking technique has been used to deposit the Cu-Al₂O₃ films by means of magnetron sputtering, and the annealing process was conducted on the synthesized films.

In this paper, it was found that the un-annealed Cu-Al₂O₃–coated Cu substrate exhibited low value of thermal resistance compared to the bare Cu substrate and to the results of previous works. Also the annealing effect does not have a significant impact on the changes of properties of the films.

It is deduced that the increase of the Cu layer thickness can further improve the thermal properties of the deposited film, which can reduce the thermal resistance of the package in system-level analysis.

The paper suggested that the Cu-Al₂O₃–coated Cu substrate can be used as alternative TIM for the thermal management of the application of LEDs.

In this paper, the Cu substrate has been used as the substrate for the Cu-Al₂O₃ films, as the Cu substrate has higher thermal conductivity compared to the Al substrate as shown in previous work.

At the end of this chapter, learners should be able to:

• Define accounting.

• Explain the objectives of financial accounting/reporting.

• Explain regulatory framework for financial reporting.

• Appreciate why human resource managers should care about accounting.

Define accounting.

Explain the objectives of financial accounting/reporting.

Explain regulatory framework for financial reporting.

Appreciate why human resource managers should care about accounting.

After reading this chapter you should be able to:

• Understand what is meant by relocation cost.

• Explain the management and disbursement of relocating costs.

• Critically evaluate the calculation of relocation costs.

• Reflect on the role of human resource managers in relation to the future of the costs of relocation.

Understand what is meant by relocation cost.

Explain the management and disbursement of relocating costs.

Critically evaluate the calculation of relocation costs.

Reflect on the role of human resource managers in relation to the future of the costs of relocation.